NewsNew method developed to improve durability of
nano-electronic components, further semiconductor
manufacturing

2nd June 2021by admin0
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University of South Florida researchers recently
developed a novel approach to mitigating electromigration in
nanoscale electronic interconnects that are ubiquitous in
state-of-the-art integrated circuits. This was achieved by coating
copper metal interconnects with hexagonal boron nitride (hBN), an
atomically-thin insulating two-dimensional (2-D) material that
shares a similar structure as the “wonder material”
graphene.

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    New Fusion

    The New Fusion technology is based on a phenomenon called triplet-triplet annihilation (TTA) which is a process in which two triplet excitons annihilate and produce a higher energy singlet exciton.

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      New Fusion

      The New Fusion technology is based on a phenomenon called triplet-triplet annihilation (TTA) which is a process in which two triplet excitons annihilate and produce a higher energy singlet exciton.

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