NIMS has developed a dual surface architectonic
process which enables to print submicrometer-scale circuit patterns
by increasing the chemical polarity of predetermined areas on
surface, thereby promoting selective adhesion of metallic
nanoparticles to these areas. In this process, the patterned
polarity is achieved by simple treatments in ambient air which
increase the surface’s adhesiveness to ink in the treated areas. As
a result, very fine circuit lines (0.6 µm in width) can be
printed.
Development of ultra-high-resolution printed electronics
using dual surface architectonics
