Design method may boost semiconductor performance by better
handling heat

22nd June 2020by admin0

Finding ways to manage the flow of heat in silicon
could boost the performance of semiconductors, but, so far,
discovering the right design has remained elusive. Now, a team of
Penn State researchers report that a fabrication technique may
offer a path toward mastering the often chaotic flow of heat
carriers at the nanoscale in silicon and other
semiconductors.

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      The New Fusion technology is based on a phenomenon called triplet-triplet annihilation (TTA) which is a process in which two triplet excitons annihilate and produce a higher energy singlet exciton.

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